The Samsung M393ABG40M52-CYF memory module is a high-performance DDR4 RDIMM memory module, with a huge capacity of 256GB, 8Rx4 architecture, and a transmission speed of 2933Mbps, which is still considered the top tier in the market today. Although this memory module is not necessary for ordinary consumer machines, it is undoubtedly one of the essential components for high-tech enterprises, large game development companies, professional designers and digital artists< Br/>
As a server level memory module, M393ABG40M52-CYF adopts a DDR4 operating frequency of 2133/2400/2666/2933 MHz and a low voltage design of 1.2V, which can effectively help reduce the energy consumption of the entire system, fully utilize energy resources, and not affect the performance of the memory module. It has excellent heat dissipation performance, fully reflecting Samsung's high attention to technical details and professional manufacturing level< Br/>
The biggest highlight is its use of 3DS (Three Dimensional Stack) technology, which uses vertical stacking technology to achieve the considerable capacity and two digit Gbps transmission speed of semiconductor giants. The M393ABG40M52-CYF memory module is the fourth generation 16 layer stacking structure of 3DS, which can provide higher memory capacity, bandwidth, and better price performance ratio. The actual test results show that the performance of 3DS memory modules has been improved by more than twice compared to ordinary memory modules< Br/>
At the same time, M393ABG40M52-CYF also has strong stability, making it easy to handle and perform well in complex application scenarios such as large-scale games, graphics rendering, and virtualization. Its memory capacity is sufficient to meet the storage requirements of high-performance computing materials, ensuring smooth and efficient processing operations, as well as ensuring data security and operational accuracy< Br/>
To sum up, Samsung M393ABG40M52-CYF memory module is an excellent high-end product, adhering to Samsung's rigorous spirit and technological innovation concept, providing strong support for server, virtualization, High-performance computing, HPC and other application scenarios.